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| Casting Mode | Tensile Strength Rm(MPa) |
Yield Strength Rp0.2(MPa) |
Elongation A(%) |
Brinell Hardness (HBW) |
Conductivity (%IACS) |
Thermal Conductivity W/（m·K） |
Heat Treatment Mold | Characteristic | |
| Die-casting/Recasting | F | High Thermal Conductivity | |||||||
| Si | Fe | Cu | Mn | Mg | Zn | Ti | Other | Al |
| 10~11 | ≤0.6 | ≤0.3 | ≤0.5 | ≤0.1 | ≤0.1 | ≤0.2 | Impurity all≤1.6 | Tolerance |
SCAN ME
SCAN ME