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| Casting Mode | Tensile Strength Rm(MPa) |
Yield Strength Rp0.2(MPa) |
Elongation A(%) |
Brinell Hardness (HBW) |
Conductivity (%IACS) |
Thermal Conductivity W/（m·K） |
Heat Treatment Mold | Characteristic | |
| Die-casting | T5 | High Tensile/High Thermal Conductivity | |||||||
| Si | Fe | Cu | Mn | Mg | Zn | Ti | Cr | Pb | Sn | Cd | Sr | Other | Al |
| 11.0-15.0 | ≤0.9 | ≤0.6 | ≤0.5 | 0.1-1.0 | ≤0.5 | - | ≤0.2 | ≤0.1 | ≤0.1 | ≤0.01 | 0.02-0.04 | Only≤0.01 all≤0.2 | Tolerance |
SCAN ME
SCAN ME