H-A

product uses
mobile phone board, communication components electronic and electrical components, and other High thermal conductivity parts

main features
good thermal conductivity

Performance

Casting Mode	Tensile Strength Rm(MPa)	Yield Strength Rp0.2(MPa)	Elongation A(%)	Brinell Hardness (HBW)	Conductivity (%IACS)	Thermal Conductivity W/（m·K）	Heat Treatment Mold		Characteristic
Die-casting	≥300	≥170	≥3	≥80	≥33	≥150	Heat Treatment	F	High Tensile/High Thermal Conductivity
Die-casting	≥320	≥230	≥2	≥85	≥33	≥150	Heat Treatment	T5	High Tensile/High Thermal Conductivity

Main Components

Other

11.0-13.5

≤0.7

0.2-1.0

≤1.3

0.2-1.3

≤0.2

≤0.3

≤0.1

≤0.01

≤0.1

Only≤0.05，all≤0.15

Tolerance