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| Casting Mode | Tensile Strength Rm(MPa) |
Yield Strength Rp0.2(MPa) |
Elongation A(%) |
Brinell Hardness (HBW) |
Conductivity (%IACS) |
Thermal Conductivity W/（m·K） |
Heat Treatment Mold | Characteristic | |
| Die-casting/Semisolid | T5/T6 | High Thermal Conductivity/High Tensile |
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| Si | Fe | Cu | Mn | Mg | Zn | Ti | Ni | Pb | Sn | Cd | Other | Al |
| 6.5~9.0 | ≤1.0 | ≤0.1 | ≤0.55 | 0.2-0.5 | ≤0.15 | ≤0.2 | ≤0.15 | ≤0.15 | ≤0.05 | ＜0.01 | Only≤0.05 all≤0.15 | Tolerance |
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