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H-A

product uses
mobile phone board, communication components electronic and electrical components, and other High thermal conductivity parts
 

main features
good thermal conductivity

Performance
Casting Mode Tensile Strength
Rm(MPa)
Yield Strength
Rp0.2(MPa)
Elongation
A(%)
Brinell Hardness
(HBW)
Conductivity
(%IACS)
Thermal Conductivity
W/(m·K)
Heat Treatment Mold Characteristic
Die-casting ≥300 ≥170 ≥3 ≥80 ≥33 ≥150 Heat Treatment F High Tensile/High Thermal Conductivity
≥320 ≥230 ≥2 ≥85 ≥33 ≥150 T5
Main Components
Si Fe Cu  Mn  Mg Zn Ti Cr Ni Pb Sn Cd Sr B Other Al
11.0-13.5 ≤0.7 0.2-1.0 ≤1.3 0.2-1.3 ≤0.2 ≤0.3 ≤0.3   ≤0.1 ≤0.1 ≤0.01 ≤0.1 ≤0.1 Only≤0.05,all≤0.15  Tolerance